Innovation Beyond the Chip: Exploring Advanced Packaging Architectures
For decades, the semiconductor industry relied on Moore’s Law—the idea that the number of transistors on a chip doubles roughly...
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Insights from the minds of innovators
KLA Announces Fourth Quarter Earnings
The infographic below highlights KLA’s key financial information from the earnings report for the fourth quarter, as well as...
Some of Our Favorite Advance Stories of 2022
KLA Advance covered a lot of ground in 2022 by writing about our products, employees, and initiatives supporting communities...
KLA Celebrates the 75th Anniversary of the Transistor
Semiconductors chips – the heart of our modern electronic devices – are built atop a technology first introduced 75...
KLA Docu-Series: The Toughest Problems Solved by Engineers for Axion<sup>®</sup> T2000
What is the toughest problem you ever solved? For a team of engineers and scientists in KLA’s metrology division,...
Axion<sup>®</sup> T2000: X-Ray Vision for Vertical Memory Devices
KLA’s new Axion® T2000 metrology system harnesses the power of X-rays to measure the complex vertical structures that form...
Spotlight on KLA Korea: Focus on Customers and Community
Our virtual tour of KLA’s global locations continues with a spotlight on KLA Korea. Operating in South Korea since...
KLA Ann Arbor Hackathon Tackles Digital Transformation
Keeping with KLA’s vision of turning ideas into possibilities by creating transformative solutions, 75 employees in Ann Arbor, Michigan brainstormed...
KLA Announces Third Quarter Earnings
The video below highlights KLA’s key financial information from the earnings report for the third quarter. To read the...
New Orbotech Corus™ Offers Double-Sided Imaging for High-Density Interconnect PCBs and IC Substrates
The new Orbotech Corus™ 8M direct imaging (DI) system is the first solution built on KLA’s all-in-one revolutionary Orbotech...