Innovation Beyond the Chip: Exploring Advanced Packaging Architectures
For decades, the semiconductor industry relied on Moore’s Law—the idea that the number of transistors on a chip doubles roughly...
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KLA Breaks Ground on New R&D and Manufacturing Facility in Newport, Wales
To mark the start of construction for KLA’s new research-and-development (R&D) and manufacturing center in Newport, Wales, KLA executives...
Multidisciplinary: Engineer’s Journey from Apprentice to Leader
We caught up with Matt Hill, manufacturing manager, Allentown, Pennsylvania, who shares some thoughts with people seeking to explore...
KLA Location Spotlight: Yavne, Israel
We return to Israel on our virtual tour of our global locations. This time to Yavne, situated just south...
Interns Talk About their Experiences in KLA’s Culture of Learning
University students gained valuable on-the-job training and experience across multiple functions during summer 2022 internships at KLA’s global locations....
Achieve ‘Zero Tolerance’ Die Sorting with ICOS™ F260
Today’s chip manufacturers contend with strict requirements when it comes to quality assurance, since more complex chips are powering...
Trending: KLA’s ‘Future of Advanced Packaging’ Video
In the last few years, the role of semiconductor packaging has been evolving into a key enabler of the...
KLA Publishes 2021 Global Impact Report – Shares New Climate Goals
KLA is publishing its latest Global Impact Report, detailing progress of our environmental, social and governance (ESG) programs, results...
Making the World a Better Place: Engineer Helps to Shape Next Generation of Technology and Technologists
When Saravanan Paramasivam graduated from university, he wanted to find an intellectually stimulating career – and inspire others toward...
KLA Announces Second Quarter Earnings
The infographic below highlights KLA’s key financial information from the earnings report for the second quarter, as well as...