Innovation Beyond the Chip: Exploring Advanced Packaging Architectures
For decades, the semiconductor industry relied on Moore’s Law—the idea that the number of transistors on a chip doubles roughly...
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Insights from the minds of innovators
Microelectronics World Talks Shop at SEMICON West
SEMICON West 2023 is only days away, which is a good time to reflect on not only the event,...
A Fine Future: IC Substrates Essentials, Part I
The electronics industry’s quest for higher performance and greater speed continues to intensify, driving growing complexity in front end...
British Army Veteran Delivers High-Tech Training to KLA Customers
During a decade of service in the British Army as a training instructor, Adam Jones worked with next-generation technologies...
Focus on the Fab: Quick and Effective Action by KLA CSEs
KLA’s customer support engineers (CSEs) Mike Trojillo in the U.S. and Claire Corrigan in Ireland share a determination to...
Meet Yanghyong Kim, New KLA Korea Country President
Industry veteran Yanghyong Kim is the new country president of KLA Korea, bringing almost three decades of deep experience...
KLA Engineer Earns First SEMICON Emerging Young Leader Award
Dr. Avinash Srinivasan, senior manufacturing design engineer, Global Operations, KLA Singapore, is the inaugural recipient of the SEMICON Southeast...
KLA Helps Robotics Teams Advance their STEM Knowledge
KLA Foundation and KLA employee volunteers are helping to advance science, technology, engineering and math (STEM) education by supporting...
Accelerating Innovation in the Automotive Industry: By KLA President and CEO Rick Wallace
I have just finished an exciting day at imec’s signature event, the ITF-World in Belgium. For those who don’t...
Plasma Dicing 101, Part II
Dicing takes place near the end of the semiconductor process flow. At this point the silicon wafer is finally...